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The global automotive industry is witnessing a surge in demand for Autonomous Emergency Braking (AEB) systems, driven by both regulatory mandates and market adoption. This rapid growth is creating new opportunities across the automotive electronics value chain. According to Precedence Research, the global AEB market is projected to reach $74.68 billion in 2025 and expand to $134.41 billion by 2034, with a robust CAGR of 6.7%.

AEB—Autonomous Emergency Braking—is a critical active safety feature within Advanced Driver Assistance Systems (ADAS). It relies on a highly integrated technology architecture comprising three core components: sensing, control, and actuation.

JCET is leveraging its comprehensive packaging and testing solutions to accelerate AEB system development and enhance safety for intelligent mobility. Experts from JCET’s Automotive Electronics BU explain that AEB systems integrate a wide range of chips, including MCU, CIS, ISP, SerDes, MMIC, laser drivers, ADC, point-cloud processors, signal conditioners, MEMS sensors, motor drivers, safety MCUs, and CAN transceivers. Packaging formats span TO series, SOP series, QFP, DFN/QFN, BGA, LGA, and SiP.

Automotive-grade packaging must withstand extreme conditions—operating reliably from -40°C to 125°C or beyond. Precise thermal expansion coefficient (CTE) matching is essential to prevent failures caused by thermal cycling. Additionally, packaging must deliver high mechanical stability and fatigue resistance to endure continuous vibration and shock during vehicle operation. Robust electromagnetic compatibility is also critical to minimize interference in complex automotive environments.

With deep expertise and large-scale production capabilities in automotive electronics, JCET offers end-to-end packaging and testing solutions for AEB systems, backed by global manufacturing capacity. Our technology portfolio covers everything from traditional lead-frame and organic substrate packages to wafer-level and advanced system-in-package (SiP) solutions—supporting both single-chip and multi-chip integration. JCET has achieved high-volume production for Grade 0 and Grade 1 automotive chips and operates under a stringent automotive quality system, ensuring the safety and reliability of AEB systems worldwide.