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March 10, Shanghai, China — The Advanced Packaging Developers Conference (APDC), Robotics and Automotive Chips Track, was held at JCET Shanghai Automotive Co., Ltd.

As a key pillar of JCET’s advanced packaging developer ecosystem, APDC has been successfully held twice, first in Shanghai in 2024 and then in Singapore in 2025, attracting more than 1,000 developers worldwide. This year’s event brought together over 400 developers and guests from smart vehicle and robotics companies, core component suppliers, as well as stakeholders across the semiconductor value chain, including chip design, wafer manufacturing, packaging and testing, semiconductor equipment and materials, software and services, and research institutes.

The conference also marked the first major industry event hosted by JCET Shanghai Automotive Co., Ltd. following its official commissioning earlier that day. During the event, attendees toured the company showroom to learn about JCET’s advanced packaging capabilities and smart manufacturing practices for automotive and robotics applications. Guests also enjoyed robot show, offering a more direct look at emerging application scenarios and industry trends.

Professor Liu Sheng, Academician of the Chinese Academy of Sciences and Dean of the School of Integrated Circuits at Wuhan University, delivered a keynote titled “From Automotive Grade to Embodied Intelligence: Virtual Manufacturing Enabling High?Reliability, Highly Integrated System?Level Innovation” on the main forum of APDC. Drawing on insights from both academia and industry, he highlighted the critical role of advanced packaging in high?reliability system innovation and shared perspectives on future directions.

Grounded in frontline application needs, technical experts from automakers and leading embodied intelligence robotics companies shared their latest system integration explorations for robotics and automotive chips.

To address system?level challenges in robotics and automotive chips, the conference featured seven parallel forums. Topics included robotics computing chips and advanced packaging, heterogeneous integration and high?reliability packaging validation, and packaging solutions for automotive power devices and power supply systems, among others.

Experts from JCET and across chip design, equipment, and materials companies examined key industry issues from multiple angles, from architecture to process, from materials to tools, and from design to test. Conversations emphasized engineering outcomes such as high reliability, low defectivity, end?to?end traceability, and scalable manufacturability, while promoting collaboration across the value chain on standards, methodologies, and best practices.