pgµç×Ó
Technology & Solutions
Turnkey Services
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Applications
Automotive
Computing
Storage
Edge AI
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Environmental Social & Governance
Quality Management
Conflict-Free Minerals Policy
Contact Us
Investor Relations
Financial Reports
News
Careers
English
ÖÐÎÄ
Home
Technical&Solutions
Turnkey
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Others
¾§Ô²Í¹¿é
¿É¿¿ÐÔÊÔÑéÓëʧЧÆÊÎö
Applications
Automotive
Computing
Storage
Edge AI
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Management Team Environmental, Social & Governance
Quality Management
Conflict-Free Minerals Policy
Contact Us
Investor Relations
Financial Reports
News
Careers
English
ÖÐÎÄ
Homepage
About Changden
Announcements of All Kinds
ÖÖÖÖͨ¸æ
NOTICE
Announcements of All Kinds
all
all
2025
2024
2023
2022
2021
2020
2019
2018
2017
2016
2015
2014
2013
2012
2011
2010
pgµç×ӿƼ¼¹ØÓÚÎüÊպϲ¢È«×Ê×Ó¹«Ë¾µÄͨ¸æ
2017-10-12
pgµç×ӿƼ¼¹ØÓÚ¶Ô×Ó¹«Ë¾Ôö×ʵÄͨ¸æ
2017-10-12
pgµç×ӿƼ¼¹ØÓÚÅû¶·Ç¹«¿ª¿¯ÐÐA¹É¹ÉƱԤ°¸ô߹ɯ±¸´ÅÆÍ¨¸æ
2017-10-12
pgµç×ӿƼ¼¹ØÓÚÕÙ¿ª2017ÄêµÚËÄ´ÎÔÝʱ¹É¶«´ó»áµÄ֪ͨ
2017-10-12
pgµç×ӿƼ¼¹ØÓÚ×î½üÎåÄê²»±£´æ±»Ö¤È¯î¿Ïµ²¿·ÖºÍÉúÒâËù½ÓÄÉ´¦·£»òî¿Ïµ²½·¥µÄͨ¸æ
2017-10-12
pgµç×ӿƼ¼ÉÏ´ÎÕÙļ×ʽðʹÓÃÇéÐεÄרÏ¸æ
2017-10-12
92
93
94
95
96
¡¾ÍøÕ¾µØÍ¼¡¿